Description: Due to the sophistication of mobile phones and automotive electronic products, highly challenging inspection objects at the semiconductor package manufacturing level have emerged in the SMT process. The inspection of various SiP products is an example. SMT processes such as Wafer Level SiP and Embedded PCB are also being applied in the semiconductor package manufacturing process. This webinar session will expand on how the two industries have been converging their boundaries and the impact of such a paradigm shift.
When: Thu, 15 June 2023 10:00AM PST
Where: Zoom Meeting (click button below to sign up)
Description: Vayo (Shanghai) Technology Co., Ltd., the leading intelligent NPI software solution provider, is pleased to announce that Unigen Corporation, headquarter in Silicon Valley, Newark California, USA, selected VayoPro-DFM Expert to build up their DFA/DFM analysis capability and enhance their competition advantage in prototyping assembly.
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Description: The internationally recognized iF Design Award has been granted to Flexlink for its hygienic conveyor platform WLX. This is the second, high caliber design prize that Flexlink has been awarded for its groundbreaking design with in-built user benefits.
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Description: Vayo (Shanghai) Technology Co., Ltd ("Vayo") launched a subscription business model to its intelligent NPI software products. It covers intelligent DFM analysis, SMT/placement programming, DFT analysis, fast (ICT/FP/AXI/AOI programming, work instruction document automation etc.) as a fraction of the cost of industry leaders.
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